Iinkcukacha zefilimu ye-ETFE ezibhityileyo kakhulu ezivela kumandla eXindongke
Intshayelelo yeMveliso:
Iimpawu zeFilimu ye-ETFE:
Ubushushu benkonzo eqhubekayo buqala kwi -80°C
ukuya kwi-165°C
Ubushushu obuphezulu benkonzo ukuya kuthi ga kwi-230°C
Ukumelana okuhle kakhulu kobushushu obuphezulu nobuphantsi
Iipropati ezibalaseleyo zokunganamatheli kunye ne-coefficient ephantsi
ukungqubana komphezulu
Ayisebenzi ngokweekhemikhali kwiikhemikhali ezininzi kunye nezinyibilikisi
Ayinazo izinto zokucoca, izixhobo zokulungisa okanye izongezo
Ukumelana nemozulu okugqwesileyo
Ukusebenza kakuhle kombane kuluhlu olubanzi
yeefrikhwensi kunye namaqondo obushushu
Ukuhanjiswa kokukhanya okugqwesileyo kunye nokucaca (kwendalo
ukuhanjiswa kokukhanya> 92%)
Udidi lweFilimu ye-ETFE:
I-ETFE HP (Umgangatho oPhezulu woKusebenza):
Yenziwe nge-100% yomgangatho wobunyulu obuphezulu
I-resin ye-ETFE
Ihlala isetyenziswa kwiipropati eziphezulu ze-dielectric okanye i-optical
izicelo zokungafihli nto
Indibaniselwano eyahlukileyo yokungafihli nto, ukukhanya okuphezulu
ukudluliselwa kunye nokumelana nokwaluphala ixesha elide
Indibaniselwano eyahlukileyo yokudlulisa ukukhanya okuphezulu, ukucaca, kunye nokuqina kwayo kuyenza ibe yinto exabisekileyo
kwizicelo ezifana nee-semiconductors kunye
iisekethe ezidityanisiweyo
Yenziwe ngendlela ecacileyo, enecala elinye okanye enecala eliphindwe kabini
izitayile ze-matte
Ifanelekile ukuhombisa kunye nezixhobo ezichasene negraffiti
Iinkcukacha zeFilimu ye-ETFE:
Ubukhulu buqala kwi-12μm ukuya kwi-500μm
Ububanzi obuqhelekileyo ukuya kuthi ga kwi-1600mm
Nabuphi na ububanzi obuhambelanayo obufumaneka xa buceliwe
Umphezulu oncamathelayo: unyango lweplasma kunye neekhemikhali
unyango lokugrumba
I-ETFE MR (iBanga lokuKhululwa kweMold):
Ifilimu yokukhupha elungileyo esetyenziswa kubushushu obuphezulu
inkqubo yee-composites kwaye igcina i-non-sticky egqwesileyo
iipropati.
Ithambile kakhulu kwaye ilungele kakuhle ukuthamba
iimbombo ezintsonkothileyo ezibunjiweyo
Imibala eqhelekileyo ibandakanya obomvu, oluhlaza okwesibhakabhaka okhanyayo kunye
imibala emhlophe, eyenziwe ngokwezifiso iyafumaneka xa iceliwe
Ifumaneka kwiintlobo ngeentlobo zeepateni ezineembobo
Ubunzima bomphezulu bungaphantsi kwama-20% efilimu ye-FEP.
Izicelo zeFilimu ze-ETFE:
Ifilimu ekhupha iiComposites
Inkqubo yekhemikhali kunye nezixhobo
Ukupakisha okushushu kokuvala/ukuwelda/iglu yokunyibilikisa eshushu
Uyilo lwezakhiwo/Oluhlazaindlu
Zombane / Ze-elektroniki
I-Photovoltaic / IlangaIshishini
Ukhuseleko kunye nangaphakathi
Ishishini lezonyango / lezeMithi
I-semiconductor
I-ETFE AG (Udidi lweZakhiwo):
Iipropati ezigqwesileyo zokuxhathisa i-UV, iikhemikhali
ukungakwazi ukusebenza kunye neempawu zokunganamatheli
Iipropati ezintle kakhulu zoomatshini ezisetyenzisiweyo
ezolimo kunye nezakhiwo
Ingcaciso:
| I-ETFE HP | I-ETFE AG | I-ETFEMR | |||
| Ukusebenza okuSisiseko | Iyunithi | Indlela yovavanyo | |||
| Ubunzima obuthile | I-ASTM D792 | 1.74 | |||
| Ipropati ethintela ilangatye | UL-94 | V-0 | |||
| Ukufunxwa kwamanzi | % | <0.03 | |||
| Iipropati zoomatshini | |||||
| Tensile strength | I-MPa | I-ASTM D882 | 48 | ||
| Ukwandiswa kweBre ak | % | I-ASTM D882 | 300 | ||
| Imodulus yokuThatha | I-MPa | I-ASTM D882 | 965 | ||
| Amandla okuqala okukrazula (50μm) | N | I-ASTM D1004 | 4.2 | ||
| Amandla okukrazula athambileyo (50μm) | N | I-ASTM D1922 | 2.9 | ||
| Iipropati zoBushushu | |||||
| Ubushushu bokusetyenziswa rhoqo | ℃ | UL-746 B | 165 | ||
| Indawo yokunyibilika | ℃ | I-ASTM D3418 | 260 | ||
| Iipropati zoKubona | |||||
| Ukuhanjiswa kwelanga | % | I-ASTM E424 | >90 | n / A | |
| Ubungakanani beMveliso | |||||
| Ububanzi | mm | 25-1600 | |||
| Ubukhulu | μm | 12.7-500 | |||
| Imibala Eqhelekileyo | Cacisa, Matte | Ecacileyo, engacwebezeliyo, emhlophe, luhlaza okwesibhakabhaka, obomvu, oprintiweyo, Ukusika kwe-IR | Icacile, ayicwebezeli, bomvu, luhlaza okwesibhakabhaka | ||
| Umphezulu okhoyo Unyango | |||||
| Ukukrola iikhemikhali | Unyango lweKhemikhali | ||||
| Unyango lwePlasma | Unyango lwePlasma | ||||








